Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Publication:
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Date
2015-05
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
30666.pdf
1.61 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Maggioni, Federica
;
De Vos, Joeri
;
Wang, Teng
;
Daily, Robert
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1944
since deposited on 2021-10-22
Acq. date: 2025-10-25
Citations
Metrics
Views
1944
since deposited on 2021-10-22
Acq. date: 2025-10-25
Citations