Publication:
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
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1972 since deposited on 2021-10-22
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Acq. date: 2026-04-27
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Statistics
Views
1972 since deposited on 2021-10-22
3last month
2last week
Acq. date: 2026-04-27
Citations