Publication:

Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

Date

2015-05
Proceedings Paper
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dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMaggioni, Federica
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T21:31:01Z
dc.date.available2021-10-22T21:31:01Z
dc.date.embargo9999-12-31
dc.date.issued2015-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25712
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159737
dc.source.beginpage1134
dc.source.conferenceIEEE Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego US
dc.source.endpage1141
dc.title

Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

dc.typeProceedings paper
dspace.entity.typePublication
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