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Study of damage and stress induced by backgrinding in Si wafers
Publication:
Study of damage and stress induced by backgrinding in Si wafers
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Date
2003
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Jian
;
De Wolf, Ingrid
Journal
Semiconductor Science and Technology
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1911
since deposited on 2021-10-15
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last month
1
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Acq. date: 2025-12-09
Citations
Metrics
Views
1911
since deposited on 2021-10-15
2
last month
1
last week
Acq. date: 2025-12-09
Citations