Publication:
Study of damage and stress induced by backgrinding in Si wafers
Date
| dc.contributor.author | Chen, Jian | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-15T04:08:21Z | |
| dc.date.available | 2021-10-15T04:08:21Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7310 | |
| dc.source.beginpage | 261 | |
| dc.source.endpage | 268 | |
| dc.source.issue | 4 | |
| dc.source.journal | Semiconductor Science and Technology | |
| dc.source.volume | 18 | |
| dc.title | Study of damage and stress induced by backgrinding in Si wafers | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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