Publication:

Metrology and inspection challenges for manufacturing 3D stacked IC's

Date

2013
Proceedings Paper
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dc.contributor.authorHalder, Sandip
dc.contributor.authorStiers, Karen
dc.contributor.authorMiller, Andy
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBeyne, Eric
dc.contributor.authorGuerrieri, Stefano
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorStiers, Karen
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.accessioned2021-10-21T08:06:39Z
dc.date.available2021-10-21T08:06:39Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22453
dc.source.beginpage75
dc.source.conference24th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate13/05/2012
dc.source.conferencelocationSaratoga Springs, NY USA
dc.source.endpage79
dc.title

Metrology and inspection challenges for manufacturing 3D stacked IC's

dc.typeProceedings paper
dspace.entity.typePublication
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