Publication:

Etch process modules development and integration in 3D-SOC applications

Date

2018
Journal article
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dc.contributor.authorTutunjyan, Nina
dc.contributor.authorSardo, Stefano
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorJourdain, Anne
dc.contributor.authorPeng, Lan
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorMiller, Andy
dc.contributor.authorPiumi, Daniele
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorSardo, Stefano
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorPiumi, Daniele
dc.contributor.orcidimecSardo, Stefano::0000-0002-9302-8007
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-26T06:05:15Z
dc.date.available2021-10-26T06:05:15Z
dc.date.issued2018
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31984
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0167931718301722
dc.source.beginpage38
dc.source.endpage48
dc.source.journalMicroelectronic Engineering
dc.source.volume196
dc.title

Etch process modules development and integration in 3D-SOC applications

dc.typeJournal article
dspace.entity.typePublication
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