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Impact of the high-temperature process steps on the HfAIO interpoly dielectric stacks for nonvolatile memory applications
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Impact of the high-temperature process steps on the HfAIO interpoly dielectric stacks for nonvolatile memory applications
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Date
2008-03
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ruiz Aguado, Daniel
;
Govoreanu, Bogdan
;
Favia, Paola
;
De Meyer, Kristin
;
Van Houdt, Jan
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1854
since deposited on 2021-10-17
Acq. date: 2025-12-12
Citations
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Views
1854
since deposited on 2021-10-17
Acq. date: 2025-12-12
Citations