Publication:
Impact of the high-temperature process steps on the HfAIO interpoly dielectric stacks for nonvolatile memory applications
Date
| dc.contributor.author | Ruiz Aguado, Daniel | |
| dc.contributor.author | Govoreanu, Bogdan | |
| dc.contributor.author | Favia, Paola | |
| dc.contributor.author | De Meyer, Kristin | |
| dc.contributor.author | Van Houdt, Jan | |
| dc.contributor.imecauthor | Govoreanu, Bogdan | |
| dc.contributor.imecauthor | Favia, Paola | |
| dc.contributor.imecauthor | De Meyer, Kristin | |
| dc.contributor.imecauthor | Van Houdt, Jan | |
| dc.contributor.orcidimec | Favia, Paola::0000-0002-1019-3497 | |
| dc.contributor.orcidimec | Van Houdt, Jan::0000-0003-1381-6925 | |
| dc.date.accessioned | 2021-10-17T10:21:07Z | |
| dc.date.available | 2021-10-17T10:21:07Z | |
| dc.date.issued | 2008-03 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14404 | |
| dc.source.beginpage | 1071-F02-05 | |
| dc.source.conference | Materials Science and Technology for Nonvolatile Memories | |
| dc.source.conferencedate | 24/03/2008 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Impact of the high-temperature process steps on the HfAIO interpoly dielectric stacks for nonvolatile memory applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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