Publication:

Developing TSV wet cleaning chemistry for quantum computing application

Date

2023
Journal article
https://doi.org/10.1016/j.mee.2023.112010
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dc.contributor.authorLe Tulzo, Harold
dc.contributor.authorCeleste, Loriana
dc.contributor.authorTendero, Ines
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGerets, Carine
dc.contributor.authorThomas, Candice
dc.contributor.authorCharbonnier, Jean
dc.contributor.authorDeschaseaux, Edouard
dc.contributor.authorLazerand, Thierry
dc.contributor.authorDaviot, Jerome
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorGerets, Carine
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.date.accessioned2023-09-22T10:32:16Z
dc.date.available2023-06-04T20:11:49Z
dc.date.available2023-06-08T06:48:43Z
dc.date.available2023-09-22T10:32:16Z
dc.date.embargo2025-05-01
dc.date.issued2023
dc.description.wosFundingTextThis project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union's Horizon 2020 research and innovation program and Germany, France, Belgium, Austria, Netherlands, Finland, Israel. (Please visit the project website www.matqu.eu for more information). The authors would like to thank Diane BIJOU and Samir SAFI from Technic France for fruitful discussions. For EDS analyses, a special thank is addressed to Maximilien COTTAT from PlasmaTherm.
dc.identifier.doi10.1016/j.mee.2023.112010
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41687
dc.publisherELSEVIER
dc.source.beginpage73
dc.source.endpage83
dc.source.issueArt. 112010
dc.source.journalMICROELECTRONIC ENGINEERING
dc.source.numberofpages10
dc.source.volume276
dc.subject.keywordsTSV QC cleaning
dc.title

Developing TSV wet cleaning chemistry for quantum computing application

dc.typeJournal article
dspace.entity.typePublication
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