Publication:

An analytical compact model for estimation of stress in multiple through-silicon via configurations

Date

2011
Proceedings Paper
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dc.contributor.authorEneman, Geert
dc.contributor.authorCho, Jong Hoon
dc.contributor.authorMoroz, Victor
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorChoi, Munkang
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorBeyne, Eric
dc.contributor.authorHoffmann, Thomas Y.
dc.contributor.authorVan der Plas, Geert
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.date.accessioned2021-10-19T13:26:02Z
dc.date.available2021-10-19T13:26:02Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18885
dc.source.beginpage505
dc.source.conferenceDesign, Automation and Test in Europe Conference - DATE
dc.source.conferencedate14/03/2011
dc.source.conferencelocationGrenoble France
dc.source.endpage506
dc.title

An analytical compact model for estimation of stress in multiple through-silicon via configurations

dc.typeProceedings paper
dspace.entity.typePublication
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