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Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

Date

2011
Journal article
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dc.contributor.authorWang, Bo
dc.contributor.authorTanaka, Shuji
dc.contributor.authorGuo, Bin
dc.contributor.authorVereecke, Guy
dc.contributor.authorSeveri, Simone
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorWevers, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorWang, Bo
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-19T21:37:06Z
dc.date.available2021-10-19T21:37:06Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20126
dc.identifier.urlhttp://dx.doi.org/10.1016/j.microrel.2011.06.022
dc.source.beginpage1878
dc.source.endpage1881
dc.source.issue9_11
dc.source.journalMicroelectronics Reliability
dc.source.volume51
dc.title

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

dc.typeJournal article
dspace.entity.typePublication
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