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Conference contributions
Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations
Publication:
Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations
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Date
2023-05-15
Proceedings Paper
https://doi.org/10.1109/IRPS48203.2023.10118211
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5.11 MB
Accepted version
5.38 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandemaele, Michiel
;
Kaczer, Ben
;
Bury, Erik
;
Franco, Jacopo
;
Vaisman Chasin, Adrian
;
Makarov, Alexander
;
Mertens, Hans
;
Hellings, Geert
;
Groeseneken, Guido
Journal
2023 IEEE International Reliability Physics Symposium (IRPS)
Abstract
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522
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80
last month
11
last week
Acq. date: 2025-12-11
Views
1194
since deposited on 2023-07-15
Acq. date: 2025-12-11
Citations
Metrics
Downloads
522
since deposited on 2023-07-15
80
last month
11
last week
Acq. date: 2025-12-11
Views
1194
since deposited on 2023-07-15
Acq. date: 2025-12-11
Citations