Publication:

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations

Date

2023-05-15
Proceedings Paper
https://doi.org/10.1109/IRPS48203.2023.10118211
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dc.contributor.authorVandemaele, Michiel
dc.contributor.authorKaczer, Ben
dc.contributor.authorBury, Erik
dc.contributor.authorFranco, Jacopo
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorMakarov, Alexander
dc.contributor.authorMertens, Hans
dc.contributor.authorHellings, Geert
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorVandemaele, Michiel
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorBury, Erik
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorMakarov, Alexander
dc.contributor.imecauthorMertens, Hans
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecVandemaele, Michiel::0000-0003-0740-4115
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecBury, Erik::0000-0002-5847-3949
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecMakarov, Alexander::0000-0002-9927-6511
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecGroeseneken, Guido::0000-0003-3763-2098
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.date.accessioned2023-08-08T12:12:29Z
dc.date.available2023-07-15T17:05:29Z
dc.date.available2023-07-31T10:13:51Z
dc.date.available2023-08-08T12:12:29Z
dc.date.embargo2023-05-15
dc.date.issued2023-05-15
dc.description.wosFundingTextThe work of Michiel Vandemaele was supported by the Ph.D. Fellowship of the Research Foundation-Flanders (Belgium) (application numbers 11A3619N and 11A3621N). Michiel Vandemaele gratefully acknowledges fruitful discussions with Kai-Hsin Chuang, Zlatan Stanojevic and Stanislav Tyaginov.
dc.identifier.doi10.1109/IRPS48203.2023.10118211
dc.identifier.eisbn978-1-6654-5672-2
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42148
dc.publisherIEEE
dc.source.beginpage2A.1-1
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.endpage2A.1-10
dc.source.journal2023 IEEE International Reliability Physics Symposium (IRPS)
dc.source.numberofpages10
dc.subject.disciplineElectrical & electronic engineering
dc.subject.keywordshot-carrier degradation
dc.subject.keywordstransistors
dc.title

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations

dc.typeProceedings paper
dspace.entity.typePublication
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