Publication:
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
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1938 since deposited on 2021-10-27
1last month
Acq. date: 2026-08-07
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Statistics
Views
1938 since deposited on 2021-10-27
1last month
Acq. date: 2026-08-07
Citations