Publication:
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
Date
| dc.contributor.author | Jacobs, Kristof J.P. | |
| dc.contributor.author | Li, Yunlong | |
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Jacobs, Kristof J.P. | |
| dc.contributor.imecauthor | Li, Yunlong | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Jacobs, Kristof J.P.::0000-0002-1081-3633 | |
| dc.contributor.orcidimec | Li, Yunlong::0000-0003-4791-4013 | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-27T10:49:09Z | |
| dc.date.available | 2021-10-27T10:49:09Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33206 | |
| dc.identifier.url | https://asm.confex.com/asm/istfa19/webprogram/Paper48350.html | |
| dc.source.conference | International Symposium for Testing and Failure Analysis (ISTFA2019) | |
| dc.source.conferencedate | 10/11/2019 | |
| dc.source.conferencelocation | Portland, OR USA | |
| dc.title | Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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