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Mitigating pattern collapse in high-resolution extreme ultraviolet lithography using the organic dry development rinse process
Publication:
Mitigating pattern collapse in high-resolution extreme ultraviolet lithography using the organic dry development rinse process
Date
2024
Journal article
https://doi.org/10.1117/1.JMM.23.3.034603
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Heo, Seonggil
;
Baek, Seungjoo
;
Gupta, Mihir
;
Suh, Hyo Seon
;
Kato, Kodai
;
Takeda, Satoshi
;
Shibayama, Wataru
;
Sakamoto, Rikimaru
Journal
JOURNAL OF MICRO-NANOPATTERNING MATERIALS AND METROLOGY-JM3
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137
since deposited on 2024-10-12
1
last week
Acq. date: 2025-11-03
Citations
Metrics
Views
137
since deposited on 2024-10-12
1
last week
Acq. date: 2025-11-03
Citations