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Characterization of advanced k1.9, 2.0 and 2.2 ultra-porous SiOC(H) films deposited by plasma-enhanced chemical vapor deposition

Date

2014
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dc.contributor.authorRedzheb, Murad
dc.contributor.authorArmini, Silvia
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVan der Voort, Pascalr
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-22T05:03:48Z
dc.date.available2021-10-22T05:03:48Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24428
dc.source.conferenceConference on Science and Applications of Thin Films - SATF
dc.source.conferencedate15/09/2014
dc.source.conferencelocationIzmir Turkey
dc.title

Characterization of advanced k1.9, 2.0 and 2.2 ultra-porous SiOC(H) films deposited by plasma-enhanced chemical vapor deposition

dc.typeMeeting abstract
dspace.entity.typePublication
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