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Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
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Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
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Date
2007
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sphabmixay, Kim
;
Van Olmen, Jan
;
Moon, Kwang Jin
;
Vanstreels, Kris
;
D'Haen, Jan
;
Tokei, Zsolt
;
List, S.
;
Beyer, Gerald
Journal
Microelectronic Engineering
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1851
since deposited on 2021-10-16
Acq. date: 2025-12-15
Citations
Metrics
Views
1851
since deposited on 2021-10-16
Acq. date: 2025-12-15
Citations