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Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill

Date

2007
Journal article
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dc.contributor.authorSphabmixay, Kim
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorMoon, Kwang Jin
dc.contributor.authorVanstreels, Kris
dc.contributor.authorD'Haen, Jan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorList, S.
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-10-16T19:56:22Z
dc.date.available2021-10-16T19:56:22Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12935
dc.source.beginpage2681
dc.source.endpage2685
dc.source.issue11
dc.source.journalMicroelectronic Engineering
dc.source.volume84
dc.title

Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill

dc.typeJournal article
dspace.entity.typePublication
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