FI-CDM and LICCDM testing on wafer, single die and package levels

Abstract

Although not mainstream yet, Contact Charged Device Model (CDM) electrostatic discharge (ESD) testers are being used by the industry. In this paper we compare the Low-Impedance Contact CDM tester to the industry standard Field-Induced CDM tester. We test an actual IC product at wafer, bare-die and package levels.