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MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond

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dc.contributor.authorYu, Hao
dc.contributor.authorSchaekers, Marc
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBarla, Kathy
dc.contributor.authorMocuta, Anda
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.contributor.authorDe Meyer, Kristin
dc.contributor.imecauthorYu, Hao
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBarla, Kathy
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.orcidimecYu, Hao::0000-0002-1976-0259
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-23T17:36:51Z
dc.date.available2021-10-23T17:36:51Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27638
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7486665
dc.source.beginpage19
dc.source.conference16th International Workshop on Junction Technology - IWJT
dc.source.conferencedate9/05/2016
dc.source.conferencelocationShanghai China
dc.source.endpage24
dc.title

MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond

dc.typeProceedings paper
dspace.entity.typePublication
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