Post-ion beam induced degradation of copper layers in transmission electron microscopy specimens

dc.contributor.author	Seidel, Felix
dc.contributor.author	Richard, Olivier
dc.contributor.author	Bender, Hugo
dc.contributor.author	Vandervorst, Wilfried
dc.contributor.imecauthor	Seidel, Felix
dc.contributor.imecauthor	Richard, Olivier
dc.contributor.imecauthor	Bender, Hugo
dc.contributor.imecauthor	Vandervorst, Wilfried
dc.contributor.orcidimec	Richard, Olivier::0000-0002-3994-8021
dc.date.accessioned	2021-10-22T22:42:45Z
dc.date.available	2021-10-22T22:42:45Z
dc.date.embargo	9999-12-31
dc.date.issued	2015
dc.identifier.issn	0268-1242
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/25884
dc.identifier.url	http://iopscience.iop.org/article/10.1088/0268-1242/30/11/114016/meta
dc.source.beginpage	114016
dc.source.issue	11
dc.source.journal	Semiconductor Science and Technology
dc.source.volume	30
dc.title	Post-ion beam induced degradation of copper layers in transmission electron microscopy specimens
dc.type	Journal article
dspace.entity.type	Publication
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