Publication:

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

Date

2017
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorBex, Pieter
dc.contributor.authorLofrano, Melina
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.authorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorGerets, Carine
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T04:32:13Z
dc.date.available2021-10-24T04:32:13Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28295
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8346836
dc.source.beginpage1
dc.source.conference21st European Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate10/09/2017
dc.source.conferencelocationWarsaw Poland
dc.source.endpage7
dc.title

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
34731.pdf
Size:
1.31 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions