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Thermal cycling life testing of Plated Through Hole vias in PCBs
Publication:
Thermal cycling life testing of Plated Through Hole vias in PCBs
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Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Nawghane, Chinmay
;
Vandevelde, Bart
;
Cauwe, Maarten
Journal
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1867
since deposited on 2021-10-27
Acq. date: 2025-12-15
Citations
Metrics
Views
1867
since deposited on 2021-10-27
Acq. date: 2025-12-15
Citations