Publication:

Thermal cycling life testing of Plated Through Hole vias in PCBs

Date

2019
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorNawghane, Chinmay
dc.contributor.authorVandevelde, Bart
dc.contributor.authorCauwe, Maarten
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.accessioned2021-10-27T14:37:05Z
dc.date.available2021-10-27T14:37:05Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33652
dc.source.conferenceEMPS Workshop (ESA)
dc.source.conferencedate15/05/2019
dc.source.conferencelocationParis France
dc.title

Thermal cycling life testing of Plated Through Hole vias in PCBs

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions