Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Publication:
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Date
2008
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
17341.pdf
873.67 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cauwe, M.
;
De Baets, Johan
Journal
IEEE Transactions on Advanced Packaging
Abstract
Description
Metrics
Views
1952
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-06
Citations
Metrics
Views
1952
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-06
Citations