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Articles
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Publication:
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
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Date
2008
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17341.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cauwe, M.
;
De Baets, Johan
Journal
IEEE Transactions on Advanced Packaging
Abstract
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1953
since deposited on 2021-10-17
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Acq. date: 2026-01-10
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Views
1953
since deposited on 2021-10-17
1
last month
1
last week
Acq. date: 2026-01-10
Citations