Publication:
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Date
| dc.contributor.author | Cauwe, M. | |
| dc.contributor.author | De Baets, Johan | |
| dc.contributor.imecauthor | De Baets, Johan | |
| dc.date.accessioned | 2021-10-17T06:27:19Z | |
| dc.date.available | 2021-10-17T06:27:19Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2008 | |
| dc.identifier.issn | 1521-3323 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13484 | |
| dc.source.beginpage | 649 | |
| dc.source.endpage | 656 | |
| dc.source.issue | 3 | |
| dc.source.journal | IEEE Transactions on Advanced Packaging | |
| dc.source.volume | 31 | |
| dc.title | Broadband material parameter characterization for practical high-speed interconnects on printed circuit board | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |