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Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards
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Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards
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Date
2009-07
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Parton, Els
;
Christiaens, Wim
;
Vanfleteren, Jan
Journal
Printed Circuit Design & Fab
Abstract
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1847
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Acq. date: 2025-12-11
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Views
1847
since deposited on 2021-10-18
2
last month
Acq. date: 2025-12-11
Citations