Publication:

Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards

Date

2009-07
Journal article
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dc.contributor.authorParton, Els
dc.contributor.authorChristiaens, Wim
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorParton, Els
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-18T01:30:36Z
dc.date.available2021-10-18T01:30:36Z
dc.date.issued2009-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15983
dc.source.beginpage37
dc.source.endpage39
dc.source.journalPrinted Circuit Design & Fab
dc.title

Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards

dc.typeJournal article
dspace.entity.typePublication
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