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On the impact of Gate field-plate length and barrier layer thickness on TDDB lifetime of GaN-on-Si MISHEMT devices for RF/5G/mm-Wave applications

 
dc.contributor.authorLin, Chien-Yu
dc.contributor.authorPutcha, Vamsi
dc.contributor.authorAlian, Alireza
dc.contributor.authorWaldron, Niamh
dc.contributor.authorLinten, Dimitri
dc.contributor.authorCollaert, Nadine
dc.contributor.authorChang, Ting-Chang
dc.contributor.imecauthorPutcha, Vamsi
dc.contributor.imecauthorAlian, Alireza
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecPutcha, Vamsi::0000-0003-1907-5486
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2022-01-19T11:40:06Z
dc.date.available2021-11-02T16:01:03Z
dc.date.available2022-01-19T11:40:06Z
dc.date.issued2020
dc.identifier.doi10.1109/IIRW49815.2020.9312857
dc.identifier.eisbn978-1-7281-7058-9
dc.identifier.issn1930-8841
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37871
dc.publisherIEEE
dc.source.beginpage24
dc.source.conferenceIEEE International Integrated Reliability Workshop (IIRW)
dc.source.conferencedateOCT 04-NOV 01, 2020
dc.source.conferencelocationSouth Lake Tahoe, CA, USA
dc.source.endpage30
dc.source.journalna
dc.source.numberofpages7
dc.subject.keywordsCURRENT COLLAPSE
dc.title

On the impact of Gate field-plate length and barrier layer thickness on TDDB lifetime of GaN-on-Si MISHEMT devices for RF/5G/mm-Wave applications

dc.typeProceedings paper
dspace.entity.typePublication
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