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ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
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ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
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Date
2012
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Suhard, Samuel
;
Claes, Martine
;
Civale, Yann
;
Nolmans, Philip
;
Sabuncuoglu Tezcan, Deniz
Journal
Solid State Phenomena
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1949
since deposited on 2021-10-20
Acq. date: 2025-12-16
Citations
Metrics
Views
1949
since deposited on 2021-10-20
Acq. date: 2025-12-16
Citations