Publication:

ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications

Date

2012
Journal article
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dc.contributor.authorSuhard, Samuel
dc.contributor.authorClaes, Martine
dc.contributor.authorCivale, Yann
dc.contributor.authorNolmans, Philip
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-20T16:36:01Z
dc.date.available2021-10-20T16:36:01Z
dc.date.issued2012
dc.identifier.issn1662-9779
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21569
dc.source.beginpage223
dc.source.endpage226
dc.source.journalSolid State Phenomena
dc.source.volume187
dc.title

ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications

dc.typeJournal article
dspace.entity.typePublication
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