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Conference contributions
A new ultra-thin 3D integration technique: technological and thermal investigations
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A new ultra-thin 3D integration technique: technological and thermal investigations
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Date
2000
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pinel, Stephane
;
Tasselli, Josiane
;
Marty, Antoine
;
Bailbe, Jean-Pierre
;
Beyne, Eric
;
Van Hoof, Rita
;
Marco, Santiago
;
Leseduarte, Sergio
;
Vendier, Olivier
;
Coello Vera, Augustin
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1
since deposited on 2021-10-14
Acq. date: 2025-12-12
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1946
since deposited on 2021-10-14
Acq. date: 2025-12-12
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Downloads
1
since deposited on 2021-10-14
Acq. date: 2025-12-12
Views
1946
since deposited on 2021-10-14
Acq. date: 2025-12-12
Citations