Publication:

Rapid thermal anealing of electro chemically plated Cu films

Date

2000
Proceedings Paper
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dc.contributor.authorBeyer, Gerald
dc.contributor.authorKitabijan, P.
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorProost, Joris
dc.contributor.authorBender, Hugo
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorHey, P.
dc.contributor.authorZhang, P.
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-14T12:40:58Z
dc.date.available2021-10-14T12:40:58Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4119
dc.source.beginpage167
dc.source.conferenceAdvanced Metallization Conference 1999 - AMC 1999
dc.source.conferencedate28/09/1999
dc.source.conferencelocationOrlando, FL USA
dc.source.endpage171
dc.title

Rapid thermal anealing of electro chemically plated Cu films

dc.typeProceedings paper
dspace.entity.typePublication
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