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Damage free cryogenic etch of ultra low-k materials: recent experimental results and theoretical analysis

Date

2013
Proceedings Paper
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dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorZhang, Liping
dc.contributor.authorDussart, Remi
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.date.accessioned2021-10-21T06:44:21Z
dc.date.available2021-10-21T06:44:21Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22015
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615562&contentType=Conference+Publications
dc.source.beginpage51
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.source.endpage53
dc.title

Damage free cryogenic etch of ultra low-k materials: recent experimental results and theoretical analysis

dc.typeProceedings paper
dspace.entity.typePublication
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