Publication:

Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations

Date

2010
Presentation
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dc.contributor.authorCarbonell, Laure
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorVolders, Henny
dc.contributor.authorHeylen, Nancy
dc.contributor.authorKellens, Kristof
dc.contributor.authorMertens, Sofie
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorVan Roey, Frieda
dc.contributor.authorCockburn, Andrew
dc.contributor.authorGravey, Virgine
dc.contributor.authorShah, Kavita
dc.contributor.authorRajagopalan, Ravi
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorMertens, Sofie
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorVan Roey, Frieda
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecMertens, Sofie::0000-0002-1482-6730
dc.date.accessioned2021-10-18T15:29:15Z
dc.date.available2021-10-18T15:29:15Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16823
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate5/10/2010
dc.source.conferencelocationAlbany, NY. USA
dc.title

Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations

dc.typeOral presentation
dspace.entity.typePublication
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