Publication:
Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallization
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Acq. date: 2026-01-27
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1 since deposited on 2023-04-04
Acq. date: 2026-01-27
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831 since deposited on 2023-04-04
5last month
3last week
Acq. date: 2026-01-25
Citations