Publication:

Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallization

Date

2022-06
Proceedings Paper
https://doi.org/10.1109/IITC52079.2022.9881310
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Author(s)

Soulie, Jean-Philippe
;
Tokei, Zsolt  
;
Swerts, Johan  
;
Adelmann, Christoph  

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