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Characterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems
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1942 since deposited on 2021-10-19
4last month
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Acq. date: 2026-08-10
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Statistics
Views
1942 since deposited on 2021-10-19
4last month
1last week
Acq. date: 2026-08-10
Citations