Publication:
Characterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems
Date
| dc.contributor.author | Katti, Guruprasad | |
| dc.contributor.thesisadvisor | Dehaene, Wim | |
| dc.contributor.thesisadvisor | De Meyer, Kristin | |
| dc.date.accessioned | 2021-10-19T14:45:22Z | |
| dc.date.available | 2021-10-19T14:45:22Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2011-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19161 | |
| dc.title | Characterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |