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Low temperature direct Cu-Cu immersion bonding for 3D integration
Publication:
Low temperature direct Cu-Cu immersion bonding for 3D integration
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Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Agarwal, Rahul
;
Ruythooren, Wouter
Journal
Abstract
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1897
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations
Metrics
Views
1897
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations