Publication:
Low temperature direct Cu-Cu immersion bonding for 3D integration
Date
| dc.contributor.author | Agarwal, Rahul | |
| dc.contributor.author | Ruythooren, Wouter | |
| dc.contributor.imecauthor | Ruythooren, Wouter | |
| dc.date.accessioned | 2021-10-17T21:17:23Z | |
| dc.date.available | 2021-10-17T21:17:23Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14883 | |
| dc.source.beginpage | D08-02-F06-02 | |
| dc.source.conference | Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics | |
| dc.source.conferencedate | 13/04/2009 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Low temperature direct Cu-Cu immersion bonding for 3D integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |