Publication:

Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme

Date

2013
Proceedings Paper
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dc.contributor.authorVeloso, Anabela
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorHiguchi, Yuichi
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorLee, Jae Woo
dc.contributor.authorSimoen, Eddy
dc.contributor.authorCho, Moon Ju
dc.contributor.authorRoussel, Philippe
dc.contributor.authorParaschiv, Vasile
dc.contributor.authorShi, Xiaoping
dc.contributor.authorSchram, Tom
dc.contributor.authorChew, Soon Aik
dc.contributor.authorBrus, Stephan
dc.contributor.authorDangol, Anish
dc.contributor.authorVecchio, Emma
dc.contributor.authorSebaai, Farid
dc.contributor.authorKellens, Kristof
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDevriendt, Katia
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorParaschiv, Vasile
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorDangol, Anish
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVaesen, Inge
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2021-10-21T13:55:01Z
dc.date.available2021-10-21T13:55:01Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23313
dc.source.beginpage591
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate24/09/2013
dc.source.conferencelocationFukuoka Japan
dc.source.endpage591
dc.title

Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme

dc.typeProceedings paper
dspace.entity.typePublication
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