Publication:

Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS

Date

2023

Proceedings Paper

https://doi.org/10.1109/pvsc48320.2023.10359569

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Author(s)

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Casasola Paesa, Marta

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Govaerts, Jonathan

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Sivaramakrishnan Radhakrishnan, Hariharsudan

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Daenen, Michaël

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van Vuure, Aart Willem

Journal

N/A

Statistics

807 since deposited on 2024-03-14

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Acq. date: 2026-08-11