Publication:
Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS
| dc.contributor.author | Van Dyck, Rik | |
| dc.contributor.author | Casasola Paesa, Marta | |
| dc.contributor.author | Engelen, Tine | |
| dc.contributor.author | Luo, Bin | |
| dc.contributor.author | Borgers, Tom | |
| dc.contributor.author | Govaerts, Jonathan | |
| dc.contributor.author | Sivaramakrishnan Radhakrishnan, Hariharsudan | |
| dc.contributor.author | Daenen, Michaël | |
| dc.contributor.author | Poortmans, Jef | |
| dc.contributor.author | van Vuure, Aart Willem | |
| dc.contributor.imecauthor | Van Dyck, Rik | |
| dc.contributor.imecauthor | Engelen, Tine | |
| dc.contributor.imecauthor | Luo, Bin | |
| dc.contributor.imecauthor | Borgers, Tom | |
| dc.contributor.imecauthor | Govaerts, Jonathan | |
| dc.contributor.imecauthor | Poortmans, Jef | |
| dc.contributor.imecauthor | Casasola Paesa, Marta | |
| dc.contributor.imecauthor | Sivaramakrishnan Radhakrishnan, Hariharsudan | |
| dc.contributor.imecauthor | Daenen, Michaël | |
| dc.contributor.orcidimec | Van Dyck, Rik::0000-0003-3947-4361 | |
| dc.contributor.orcidimec | Engelen, Tine::0000-0001-7653-3979 | |
| dc.contributor.orcidimec | Luo, Bin::0000-0001-8919-3678 | |
| dc.contributor.orcidimec | Borgers, Tom::0000-0002-7878-6977 | |
| dc.contributor.orcidimec | Govaerts, Jonathan::0000-0002-8908-1198 | |
| dc.contributor.orcidimec | Poortmans, Jef::0000-0003-2077-2545 | |
| dc.contributor.orcidimec | Casasola Paesa, Marta::0000-0003-1293-3708 | |
| dc.contributor.orcidimec | Sivaramakrishnan Radhakrishnan, Hariharsudan::0000-0003-1963-273X | |
| dc.contributor.orcidimec | Daenen, Michaël::0000-0002-9221-4932 | |
| dc.date.accessioned | 2024-04-29T12:01:24Z | |
| dc.date.available | 2024-03-14T18:00:42Z | |
| dc.date.available | 2024-04-29T12:01:24Z | |
| dc.date.issued | 2023 | |
| dc.identifier.doi | 10.1109/PVSC48320.2023.10359569 | |
| dc.identifier.eisbn | 978-1-6654-6059-0 | |
| dc.identifier.issn | 0160-8371 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43673 | |
| dc.publisher | IEEE | |
| dc.source.conference | IEEE 50th Photovoltaic Specialists Conference (PVSC) | |
| dc.source.conferencedate | JUN 11-16, 2023 | |
| dc.source.conferencelocation | San Juan | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 3 | |
| dc.title | Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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