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Low Resistance Stacked Via Metallization for Future Interconnects
Publication:
Low Resistance Stacked Via Metallization for Future Interconnects
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Date
2024
Proceedings Paper
https://doi.org/10.1109/IITC61274.2024.10732187
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van der Veen, Marleen
;
Farokhnejad, Anita
;
Mandal, Akhilesh Kumar
;
Struyf, Herbert
;
Park, Seongho
;
Tokei, Zsolt
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185
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Acq. date: 2026-01-08
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Views
185
since deposited on 2025-03-06
4
last month
1
last week
Acq. date: 2026-01-08
Citations