Publication:
Low Resistance Stacked Via Metallization for Future Interconnects
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-1058-9424 | |
| cris.virtual.orcid | 0000-0002-8055-2993 | |
| cris.virtual.orcid | 0000-0002-6782-5424 | |
| cris.virtual.orcid | 0000-0003-3545-3424 | |
| cris.virtual.orcid | 0000-0002-9402-8922 | |
| cris.virtual.orcid | 0000-0002-7974-252X | |
| cris.virtualsource.department | d41bbdfd-20df-46cf-9106-e8e19a469a8d | |
| cris.virtualsource.department | 549c89dd-95c0-4f89-b58d-2a0404d55cab | |
| cris.virtualsource.department | 71656083-4e54-41a6-8b58-909e9d5aed91 | |
| cris.virtualsource.department | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.department | c1a63b50-1a38-44ad-8601-a914848c9cca | |
| cris.virtualsource.department | f6d87b10-576c-4da9-97df-51ec068f1197 | |
| cris.virtualsource.orcid | d41bbdfd-20df-46cf-9106-e8e19a469a8d | |
| cris.virtualsource.orcid | 549c89dd-95c0-4f89-b58d-2a0404d55cab | |
| cris.virtualsource.orcid | 71656083-4e54-41a6-8b58-909e9d5aed91 | |
| cris.virtualsource.orcid | 5345513e-14d5-47e9-a494-1dda4ed18864 | |
| cris.virtualsource.orcid | c1a63b50-1a38-44ad-8601-a914848c9cca | |
| cris.virtualsource.orcid | f6d87b10-576c-4da9-97df-51ec068f1197 | |
| dc.contributor.author | van der Veen, Marleen | |
| dc.contributor.author | Farokhnejad, Anita | |
| dc.contributor.author | Mandal, Akhilesh Kumar | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Park, Seongho | |
| dc.contributor.author | Tokei, Zsolt | |
| dc.contributor.imecauthor | van der Veen, Marleen H. | |
| dc.contributor.imecauthor | Farokhnejad, A. | |
| dc.contributor.imecauthor | Mandal, A. Kumar | |
| dc.contributor.imecauthor | Struyf, H. | |
| dc.contributor.imecauthor | Park, S. | |
| dc.contributor.imecauthor | Tokei, Z. | |
| dc.date.accessioned | 2025-03-06T20:46:39Z | |
| dc.date.available | 2025-03-06T20:46:39Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/IITC61274.2024.10732187 | |
| dc.identifier.eisbn | 979-8-3503-8517-5 | |
| dc.identifier.isbn | 979-8-3503-8518-2 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45343 | |
| dc.publisher | IEEE | |
| dc.source.conference | 2024 International Interconnect Technology Conference | |
| dc.source.conferencedate | 2024-06-03 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.numberofpages | 3 | |
| dc.title | Low Resistance Stacked Via Metallization for Future Interconnects | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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