Publication:

Impact of Cu TSVs on BEOL metal and dielectric reliability

Date

2014
Proceedings Paper
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dc.contributor.authorLi, Yunlong
dc.contributor.authorCroes, Kristof
dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorBender, Hugo
dc.contributor.authorJourdain, Anne
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorStucchi, Michele
dc.contributor.authorVanstreels, Kris
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorWu, Chen
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T03:03:08Z
dc.date.available2021-10-22T03:03:08Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24135
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6860630&contentType=Conference+Publications
dc.source.beginpage3E.1.1
dc.source.conferenceInternational Reliability Physics Symposium - IRPS
dc.source.conferencedate1/06/2014
dc.source.conferencelocationWaikoloa, HI USA
dc.source.endpage3E.1.5
dc.title

Impact of Cu TSVs on BEOL metal and dielectric reliability

dc.typeProceedings paper
dspace.entity.typePublication
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