A new TDDB reliability prediction methodology accounting for multiple SBD and wear out

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Author(s)

;

Degraeve, Robin

;

Roussel, Philippe

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;

Kauerauf, Thomas

;

Groeseneken, Guido

Journal

IEEE Transactions on Electron Devices

Metrics

1932 since deposited on 2021-10-18

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Acq. date: 2025-12-08