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A new TDDB reliability prediction methodology accounting for multiple SBD and wear out
Publication:
A new TDDB reliability prediction methodology accounting for multiple SBD and wear out
Date
2009
Journal article
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18727.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sahhaf, Sahar
;
Degraeve, Robin
;
Roussel, Philippe
;
Kaczer, Ben
;
Kauerauf, Thomas
;
Groeseneken, Guido
Journal
IEEE Transactions on Electron Devices
Abstract
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1930
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1930
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations