Publication:

A new TDDB reliability prediction methodology accounting for multiple SBD and wear out

Date

2009
Journal article
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dc.contributor.authorSahhaf, Sahar
dc.contributor.authorDegraeve, Robin
dc.contributor.authorRoussel, Philippe
dc.contributor.authorKaczer, Ben
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorGroeseneken, Guido
dc.contributor.imecauthorSahhaf, Sahar
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.date.accessioned2021-10-18T02:33:16Z
dc.date.available2021-10-18T02:33:16Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16149
dc.source.beginpage1424
dc.source.endpage1432
dc.source.issue7
dc.source.journalIEEE Transactions on Electron Devices
dc.source.volume56
dc.title

A new TDDB reliability prediction methodology accounting for multiple SBD and wear out

dc.typeJournal article
dspace.entity.typePublication
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