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High-NA EUV Mask CD-SEM Metrology Matching, and Contour-based Comparison of Simulation Result and Wafer Print

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dc.contributor.authorBekaert, Joost
dc.contributor.authorSchatz, Jirka
dc.contributor.authorHosoya, Sotaro
dc.contributor.authorKomami, Hideaki
dc.contributor.authorRoy, Syamashree
dc.contributor.authorLibeert, Guillaume
dc.contributor.authorBaskaran, Balakumar
dc.contributor.authorPhilipsen, Vicky
dc.contributor.authorHendrickx, Eric
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorWelling, Ulrich
dc.contributor.authorTomizuka, Shosuke
dc.contributor.authorYamaji, Masataka
dc.contributor.authorTomita, Tatsuya
dc.contributor.authorFujii, Nobuaki
dc.contributor.authorYoshikawa, Shingo
dc.contributor.authorNakaya, Hideki
dc.contributor.authorIwai, Toshimichi
dc.contributor.authorOkawa, Tatsuro
dc.contributor.authorIto, Wataru
dc.date.accessioned2026-03-31T08:02:41Z
dc.date.available2026-03-31T08:02:41Z
dc.date.createdwos2026-02-20
dc.date.issued2025
dc.description.wosFundingTextThis paper received the best presentation award at the 40th European Mask and Lithography Conference (EMLC, 2025). Consequently, this paper is a re-publication of the earlier paper. [15] The authors gratefully acknowledge the contributions from Rik Jonckheere, Gunther Sterckx, Kenichi Miyaguchi, Lieve Van Look, Jad Haddad, Andreas Frommhold, and Jeroen Van de Kerkhove from imec, and Stuart Ainslie, Naoyuki Koyama, Kristian Kralik, Thomas Kippenberg, Niklas Kerndl, Yoshiaki Ogiso, and Johannes Rehli from Advantest, and Denis Ponomarenco and John Jomo from Synopsys. Finally, we want to express our appreciation towards the imec mask partners for their continued support in imec's partner program on advanced patterning. This work has been enabled in part by the Nano IC project funded by the European Union.
dc.identifier.doi10.1117/12.3078279
dc.identifier.isbn978-1-5106-9320-3
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58979
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage1368713
dc.source.conferencePhotomask Technology
dc.source.conferencedate2025-09-22
dc.source.conferencelocationMonterey
dc.source.journalPHOTOMASK TECHNOLOGY 2025
dc.source.numberofpages11
dc.title

High-NA EUV Mask CD-SEM Metrology Matching, and Contour-based Comparison of Simulation Result and Wafer Print

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-02-23
imec.internal.sourcecrawler
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